As complementary metal-oxide semiconductor (CMOS) area shrinks 50% from one node to the next, interconnect critical dimensions (CD) and pitch (or spacing) are under tight demands. At the N3 node, ...
The mood at this year’s SPIE Advanced Lithography + Patterning Symposium was decidedly upbeat. The outlook for business is good, due in large measure to expectations of high demand for chips, driven ...
SAN JOSE, Calif., Feb. 26, 2024 (GLOBE NEWSWIRE) -- Today at the SPIE Advanced Lithography + Patterning conference, Applied Materials, Inc. introduced a portfolio of products and solutions designed to ...
SANTA CLARA, Calif., Feb. 28, 2023 (GLOBE NEWSWIRE) -- Applied Materials, Inc. (AMAT) today unveiled a breakthrough in patterning technology that allows chipmakers to create high-performance ...
Applied is working with all leading-edge logic chipmakers on a growing number of applications for its Sculpta ® pattern-shaping technology Introducing innovative new etch systems, CVD patterning films ...
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