1. The OSD335x is an example of a complete system fitting into a tiny BGA package. We also discussed the advantages SiP brings to the design and manufacturing of semiconductors and how they can be ...

Path to Systems - No 3: This article provides insights into how the design and manufacturing process of system-in-package technology will extend Moore’s vision, creating Moore’s law 2.0.

For many years, System-in-Package (SiP) technology has been a focus for semiconductor packaging to address the ongoing market trend of system integration and size reduction. Today’s increased ...

After a diving accident left Jason DiSanto paralyzed from the neck down in 2009, he had to learn how to navigate life from a powered wheelchair, which he controls with a sip-and-puff system. Users sip ...

MUNICH--(BUSINESS WIRE)--Skyworks Solutions, Inc. (Nasdaq: SWKS), and Sequans Communications S.A. (NYSE: SQNS), today introduced the SKY66431, a 5G Massive IoT SiP (system-in-package) solution. This ...

The current trend in the electronics market is to seek solutions with ever-higher levels of integration at an ever lower cost. In this context, the System in Package (SiP) represents the ideal ...

The IoT represents a rapidly growing market for which high-speed wireless connections suitable for various usage systems are indispensable. The arrival of digital transportation is accelerating this ...