Samsung last month unveiled a SOCAMM2 LPDDR5-based memory module designed specifically for AI data center platforms.

SK hynix showcases its next-gen memory solutions for AI at CES 2026: with 48GB HBM4, SOCAMM, LPDDR6, and more for future AI ...

Apple has stationed executives in South Korean hotels near Samsung and SK Hynix factories. The iPhone maker is desperately ...

Innodisk, a leading global AI solution provider, announced the launch of its new AI on Dragonwing computing series, developed ...

ADLINK Technology has launched what it says is the first COM Express module to use Intel Core Ultra Series 3 processors.

SK hynix unveiled its next generation of artificial intelligence memory chips, including a 16-layer HBM4, at CES 2026 in Las Vegas on Tuesday. The chipmaker opened a customer-only exhibition booth to ...

SK hynix Inc. (or "the company", announced today that it will open a customer exhibition booth at Venetian Expo and showcase ...

Virtium, a trusted designer and manufacturer of industrial-grade memory, storage, and Edge AI solutions, today announced the launch of its new "Made in the USA" AI Accelerator Module, VMX-004, a ...

SK hynix said Tuesday it is unveiling its next generation of artificial intelligence memory chips — including a 16-layer HBM4 ...

We are all familiar enough by now with the succession of boards that have come from Raspberry Pi in Cambridge over the years, ...

TrendForce's latest investigations indicate that DRAM suppliers in 1Q26 will continue to reallocate advanced process nodes and new capacity toward server and HBM products to support rising AI server ...